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Electronic Components
MORE SPECIFIC TOPICS: Capacitors \| Diodes \| Discrete Component Interconnection \| Discrete Component Packaging \| Electro-mechanical Devices \| Electro-optical Devices \| Indicators \| Inductors \| Integrated Circuits \| Integrated Logic Components \| Operational Amplifiers \| Oscillators \| Resistors \| Sensors \| Transistors \| Vacuum Tubes
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Your request for Electronic Components resources returned limited or no results. The request has been expanded to include Operational Amplifiers, Diodes, Vacuum Tubes, Transistors, Oscillators, Integrated Logic Components, Electro-optical Devices, Electro-mechanical Devices, Discrete Component Packaging, Sensors, Resistors, Discrete Component Interconnection, Indicators, Inductors, Integrated Circuits and Capacitors resources.

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	Overcoming Mobile Fragmentation: Building Applications for Multiple Operating Systems sponsored by Recursion Software, Inc. WHITE PAPER - This paper discusses some of the challenges and trade-offs developers must make and highlights one solution to overcoming them. Posted: October 3, 2008 \| Published: October 3, 2008 Topics: BREW \| CORBA \| IIOP \| Java \| Linux \| Sensors \| SOAP \| Software \| XML

	Beyond the Internet: Building Multiplatform P2P Communities sponsored by Recursion Software, Inc. WHITE PAPER - Read this white paper to learn the basic technology requirements to enable intelligent apps and prepare your organization for the next generation of community-based software development. Posted: October 3, 2008 \| Published: October 3, 2008 Topics: Bluetooth \| CDMA \| CORBA \| GPS \| Location-Based Services \| Middleware \| RFID \| Sensors \| Set-Top Boxes \| SMS \| SOA \| Social Networking \| Software \| UWB

	Five Major Power Distribution Considerations for Data Center Racks sponsored by Avocent WHITE PAPER - Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level. Posted: February 11, 2008 \| Published: February 1, 2008 Topics: Capacitors \| Circuit Design \| Data Center Management \| Power Supplies \| Rack Enclosures \| Rack Servers

	Determining Total Cost of Ownership for Data Center and Network Room Infrastructure sponsored by APC WHITE PAPER - This white paper describes an improved method for measuring TCO for data center and network room physical infrastructure, and provides examples on how to relate these costs to the overall IT infrastructure and evaluate cost control strategies. Posted: June 4, 2007 \| Published: February 1, 2005 Topics: Application Life-Cycle Management \| Capacitors \| Cooling Equipment \| Data Center Management \| Data Centers \| IT Infrastructure \| Physical Security \| Security Management \| TCO

	BCM3341 BroadVoice™ VoIP Broadband IC sponsored by Broadcom Corporation PRODUCT OVERVIEW - The BroadVoice VoIP solution allows IP telephony equipment manufacturers and broadband DSL and cable service providers to economically offer a distinctly more advanced telephone service to consumers and businesses worldwide. Posted: August 8, 2004 \| Published: August 1, 2004 Topics: Cable Modems \| Integrated Circuits \| VoIP

	More Fingerprint Sensors Added to TI’s Flexible, Cost-efficient and Easy-to-Use Fingerprint Authentication Development Tool sponsored by Texas Instruments, Inc. PRESS RELEASE - TI's Fingerprint Authentication Development Tool (FADT). It includes all the software to get started plus the industry's first multi-platform, fingerprint sensor expansion boards with TI's DSP Starter Kits (DSKs). Posted: July 14, 2004 \| Published: July 1, 2004 Topics: Authentication \| Digital Signal Processors \| Fingerprinting \| Sensors \| Software Development Tools

	HyperTransport Bridge sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Bridge core, code named HyperBridge, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Host sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Host core, code named HyperHost, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Tunnel sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Tunnel core, code named HyperTunnel, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Cave sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Cave core, code named HyperCave, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

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